
PSS MBS22016
12A/2~4.5V/120℃
PSS MBS32016
24A/3~4V/120℃
普賽斯(PREISE) /
PSS MBS22016
光模塊 / COB 整合式老化系統 (MBS22016) 用於光模組的老化篩選以及可靠性分析。該系統提供 2~4.5V 恆壓以及最高 120℃ 高溫老化條件,同時對模組的工作電流、電壓以及工作環境溫度進行即時監控測試,並自動進行失效判斷。
Real-time storage of monitoring data supports tracing of burn-in failures, and via DDM records the module voltage, temperature, bias current, transmit power, and receive power. Supports maximum up to 2016 modules/COB (SFP package) in one time burn-in cycle.




Application
- Supports online burn-in screening of XFP, SFP+, QSFP+, QSFP-DD, CFP and other package types (expandable assembly types)
- Supports the stringent requirements of high-speed module product testing
Features
- One board provides a max. current of 12A
- The voltage range can be set to 2~4.5V
- Support voltage and current monitoring function
- Compatible with various packaged modules and communication protocols
- Equipped with two independent burn-in chambers, different parameters can be set for product burn-in tests.
- Maxi. temperature up to 120℃
- Via DDM can track module serial number and record the voltage, temperature, bias current, transmit power and receive power.
Technical specification
Item | Specification |
---|---|
Test Paths[Note 1] | 28 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 2016 modules (SFP package), power consumption of a single module ≤ 1.4W; 12 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 864 modules (QSFP package), power consumption of a single module ≤ 3.3W; 3 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 216 modules (QSFP-DD package), power consumption of a single module ≤ 13.2W |
Number of Independent Temperature Zones | 2 |
Voltage Output Range | 2~4.5V,±1% FS±50mV |
Voltage Monitoring | 2~4.5V,±1% FS±50mV |
Current Limit Range | XFP、SFP+、QSFP+:0~1.2A,±0.5% FS±2mA; QSFP-DD、CFP:0~4A,±0.5% FS±2mA |
Current Monitoring | XFP、SFP+、QSFP+:0~1.2A,±0.5% FS±2mA; QSFP-DD、CFP:0~4A,±0.5% FS±2mA |
Module Assembly | Support XFP, SFP+, QSFP+, QSFP-DD, CFP and other assembly (Expandable assembly types) |
I2C DDM Data Reading | Support 8472 protocol, 8436 protocol, cmis4.0 protocol |
Temperature Range | RT+30℃~120℃ (no load) |
Temperature Accuracy | ±2℃ |
Temperature uniformity【Air】 | Full load ≤±3℃, No load ≤±2℃ |
Temperature Overshoot | ≤3℃ |
Long-term Temperature Stability | ±1℃ |
Rising time | 2℃/min |
Power | The total power of a single chamber is ≤1.5KW@50℃; Burn-in chamber power: 10KW during heating, ≤5KW at stable constant temperature; Module working power: Determined by the load module power (With 300mA module current and 2016 modules load, the total power consumption is about 3KW); The total power of the equipment is approximately equal to the power of the burn-in chamber plus the working power of the module |
EOS Test



Typical Data
The ambient temperature of the chamber is set to 50°C, and the current of the QSFPDD-SR8 module is about 2.5A,
The module temperature is stable at around 65.3℃, and the temperature fluctuation is less than 0.4℃ over 8 hours.

Under full load, reading the temperature data of the modules evenly distributed in the upper, middle, and lower layers to analyze the temperature uniformity.

For all the above test data, the maximum and minimum temperature difference is 8.5℃

For all the above test data, the maximum and minimum temperature difference is 7.9℃
Optional Items
Burn-In Chamber
Item | Spec. |
---|---|
#1 | Optical Module |
#2 | COB |
普賽斯(PREISE) /
PSS MBS32016
光模塊 / COB 整合式老化系統 (MBS32016) 用於光模組的老化篩選以及可靠性分析。該系統提供 3~4V 恆壓以及最高 120℃ 高溫老化條件,同時對模組的工作電流、電壓以及工作環境溫度進行即時監控測試,並自動進行失效判斷。
Real-time storage of monitoring data supports tracing of burn-in failures, and via DDM records the module voltage, temperature, bias current, transmit power, and receive power. Supports maximum up to 2016 modules/COB (SFP package) in one time burn-in cycle.




Application
- Supports online burn-in screening of XFP, SFP+, QSFP+, QSFP-DD, OSFP, CFP and other package types (expandable assembly types)
- Supports the stringent requirements of high-speed module product testing
Features
- One board provides a max. current of 24A
- The voltage range can be set to 3~4V
- Support voltage and current monitoring function
- Compatible with various packaged modules and communication protocols
- Equipped with two independent burn-in chambers, different parameters can be set for product burn-in tests.
- Maxi. temperature up to 120℃
- The heat dissipation can be dissipated through water circulation, and the burn-in heat balance can be automatically adjusted to make full use of the module's own power consumption and reduce the heat power consumption of the burn-in chambers.
- Via DDM can track module serial number and record the voltage, temperature, bias current, transmit power and receive power.
Technical specification
Item | Specification |
---|---|
Test Paths[Note 1] | 28 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 2016 modules (SFP package), single module current ≤ 0.85A; 12 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 864 modules (QSFP package), single module current ≤ 1.2A; 6 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 432 modules (QSFP-DD package), single module current ≤ 4A; 6 pcs x 6 layers x 6 burn-in boards per layer x 2 upper and lower chambers, a total of 432 modules (OSFP package), single module current ≤ 4A [Note] If the actual current of the module exceeds the range, a separate burn-in board can be customized |
Number of Independent Temperature Zones | 2 |
Voltage Output Range | 3~4V,±1% FS±50mV |
Voltage Monitoring | 3~4V,±1% FS±50mV |
Current Limit Range [Note] Based on the existing burn-in board model | SFP+:0~0.85A,±0.5% FS±2mA; QSFP、QSFP+:0~2A,±0.5% FS±2mA; QSFP-DD、CFP、OSFP:0~4A,±0.5% FS±2mA [Note] If the actual current of the module exceeds the range, a separate burn-in board can be customized |
Current Monitoring [Note] Based on the existing burn-in board model | XFP、SFP+、QSFP+:0~1.2A,±0.5% FS±2mA; QSFP、QSFP+:0~2A,±0.5% FS±2mA; QSFP-DD、CFP、OSFP:0~4A,±0.5% FS±2mA [Note] If the actual current of the module exceeds the range, a separate burn-in board can be customized |
Module Assembly | Support XFP, SFP+, QSFP+, QSFP-DD, OSFP ,CFP and other assembly (Expandable assembly types) |
I2C DDM Data Reading | Support 8472 protocol, 8436 protocol, cmis protocol |
Temperature Range | RT+30℃~120℃ (no load) |
Temperature Accuracy | ±2℃ |
Temperature uniformity【Air】 | Full load ≤±3℃, No load ≤±2℃ |
Temperature Overshoot | ≤3℃ |
Long-term Temperature Stability | ±1℃ |
Rising time | ≥ 2℃/min |
Power | The total power of a single-cell module is ≤3KW@60℃; Burn-in chamber power: 10KW during heating, ≤5KW at stable constant temperature; Module working power: Determined by the load module power (With 300mA module current and 2016 modules load, the total power consumption is about 3KW); The total power of the equipment is approximately equal to the power of the burn-in chamber plus the working power of the module |
Database | Self-provided SQL database to trace and save module test data |
Waterpath Specifications | Water temperature range: 20℃~28℃ Water pressure range: 0.2Mpa~0.3Mpa Flow rate range: not less than 6.5L/min |
In addition, the system has different burn-in board forms for different module power consumption. Please confirm with us if you would like to know whether the different burn-in boards can be used compatibly.
EOS Test



Typical Data
The ambient temperature of the chamber is set to 50°C, and the current of the QSFPDD-SR8 module is about 2.5A,
The module temperature is stable at around 65.3℃, and the temperature fluctuation is less than 0.4℃ over 8 hours.

Optional Items
Burn-In Chamber
Item | Spec. |
---|---|
#1 | Optical Module |
#2 | COB |