普賽斯(PREISE) / COBT2001
COB Automated Testing System
Designed to meet the testing requirements of VCSEL multimode packaging before and after optical coupling. This system not only verifies the functionality and optical reliability of COB modules, but also supports reliability testing of VCSEL optical chips.
With a uniquely designed optical receiving unit, it accommodates devices under test across various power ranges while ensuring measurement repeatability and consistency. It supports multiple key parameter measurements, including VCC, ICC, PO, ITH, and SE.
Featuring high consistency, reliability, and production efficiency, the system enables dual-board, four-station parallel testing — providing an all-in-one solution for SFP, QSFP, QSFP-DD, and OSFP package types.
Features
- Compatible with PSS aging boards, enabling one-stop COB aging and testing operations.
- Strong module and protocol compatibility: supports SFP, QSFP, QSFP28, QSFP-DD, and OSFP package types; applicable for 100G / 200G / 400G / 800G testing, and compatible with 8472, 8436, and CMIS communication protocols.
- High-efficiency parallel testing: supports dual-board, four-station PD testing; large-area PD light-receiving design ensures measurement repeatability and consistency.
- Adjustable PD structure: allows precise adjustment based on the divergence angle of the device under test, improving optical alignment accuracy.
- Rail-guided structural design: ensures consistent aging board positioning for stable and convenient operation.
- Ion air nozzle design: effectively eliminates static electricity, enhances heat dissipation, and ensures optical module safety.
- Reliability analysis support: enables pre- and post-aging data comparison for effective chip reliability evaluation.
- Flexible optical path options: supports both vertical emission and parallel optical architectures.
- Scalable functionality: supports COB debugging, DDMI information reading, and optional COB firmware programming features.
Technical specification
| Item | Specification |
|---|---|
| Supported Module Types | SFP, QSFP, QSFP-DD, OSFP, and other package types |
| Aging Board Capacity |  SFP type: 28 pcs QSFP type: 12 pcs OSFP type（Typical）：6PCS QSFP-DD type（Typical）：10PCSActual quantity depends on module power consumption and package type |
| Parallel Testing | Supports dual-board, four-station parallel testing |
| Protocol Compatibility | SFP ≤3.3W QSFP SR4/SR8 ≤6.6W QSFP-DD SR8 ≤12W OSFP SR8≤16W |
| Protocol Compatibility | SFF8472, SFF8436, CMIS 5.0, and others |
| Optical Power Detection Range | 0-10mw，1%FS±50uW |
| Test Efficiency | UPH > 300 pcs/hour (400G SR8, single station) Ith scanning test not included |
| Test Parameter | Supports PI curve, Ibias, Po, Ith, ΔIth (pre/post aging), and ΔPo (pre/post aging) |
| VCC Voltage | Range: 3~3.6 V Accuracy: 0.1%FS ±4 mV |
EOS Test
3.3V COB Power-On Waveform
3.3V COB Power-Off Waveform
Consumable List
| Item | Description / Estimation |
|---|---|
| Adapter Board PCBA | The gold-finger connector is located on the side interfacing with the aging board. This connector is a consumable component with a typical service life of about 3 months or ≥5000 insertion/removal cycles. The actual replacement cycle may vary depending on customer usage frequency and operating conditions. |
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